Cartridge assembly, jig, jig assembly, and apparatus for electroless plating

ABSTRACT

A cartridge assembly, a jig, a jig assembly and an apparatus for electroless plating are disclosed. The cartridge includes a first cartridge and a second cartridge. The first cartridge includes a holder disposed at a corner thereof, and the holder is formed to protrude toward the second cartridge. The second cartridge includes an accommodating portion disposed at a corner thereof, and the accommodating portion accommodates at least a portion of the holder.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of and priority to Korean Patent Application No. 10-2021-0194803 filed on Dec. 31, 2021, the entirety of which is incorporated herein by reference as if fully set forth herein for all purposes.

TECHNICAL FIELD

The present disclosure relates to a cartridge assembly, a jig, a jig assembly, and an apparatus for electroless plating.

DISCUSSION OF THE RELATED ART

Electroless plating means a plating method capable of reducing metal ions in a plating solution through chemical reaction without using DC power. Such electroless plating is used to precipitate a coating film by reducing metal ions by electrons separated in oxidation reaction of a reducing agent included in a plating solution.

Electroless plating does not require external power during plating, and may achieve plating in a uniform thickness and easy mass production. Electroless plating is widely used in the electronic element industry, the industrial machinery industry, the automobile/aircraft industry, etc. for purposes of fine wiring formation, corrosion prevention, excellent hardness, increased lubricity, enhanced solderability, enhanced bondability, and so on.

For application of the electroless plating to an electrode portion of a vibration apparatus (or a sound apparatus), however, an immersion cartridge and a jig thereof, which are capable of achieving appropriate mass production, are needed.

The description provided in the discussion of the related art section should not be assumed to be prior art merely because it is mentioned in or associated with that section. The discussion of the related art section may include information that describes one or more aspects of the subject technology, and the description in this section does not limit the invention.

SUMMARY

The inventors of the present disclosure have recognized the problems and disadvantages of the related art and have performed extensive research and experiments for implementing an immersion cartridge and a jig thereof which are applicable to an electrode portion of a vibration apparatus (or a sound apparatus) and achieve easy mass production thereof. Therefore, through the extensive research and experiments, the inventors of the present disclosure have invented a cartridge assembly and a jig capable of achieving an enhancement in uniformity of an electrode portion and an enhancement in processibility for mass production.

Accordingly, embodiments of the present disclosure are directed to a cartridge assembly for electroless plating and a jig thereof that substantially obviate one or more problems due to limitations and disadvantages of the related art.

An aspect of the present disclosure is to provide a cartridge assembly for electroless plating which may not only achieve mass production thereof through a simple configuration thereof and a reduction in cost (or manufacturing costs), but also may be usable as an electrode portion of a vibration apparatus (or a sound apparatus), and a jig, a jig assembly, and an apparatus for electroless plating.

Additional features, advantages, and aspects are set forth in the present disclosure and will also be apparent from the present disclosure or may be learned by practice of the inventive concepts provided herein. Other features, advantages, and aspects of the present disclosure may be realized and attained by the descriptions provided in the present disclosure, or derivable therefrom, and the claims hereof as well as the appended drawings.

To achieve these and other advantages and aspects of the inventive concepts, as embodied and broadly described herein, a cartridge assembly according to one or more embodiments of the present disclosure may comprise a first cartridge, and a second cartridge. The first cartridge may comprise a holder disposed at a corner thereof, and the holder is formed to protrude toward the second cartridge. The second cartridge may comprise an accommodating portion disposed at a corner thereof, and the accommodating portion accommodates at least a portion of the holder.

In another aspect, a jig according to one or more embodiments of the present disclosure may comprise a pair of side parts facing each other, holders formed at inner portions of the pair of side parts, the holders being protruded and facing each other, a first frame configured to interconnect at least portions of upper portions of the pair of side parts, a second frame configured to interconnect at least portions of lower portions of the pair of side parts, a first wing portion attached to the upper portions of each of the pair of side parts at an outside of the pair of side parts, and a second wing portion attached to the lower portions of each of the pair of side parts at the outside of the pair of side parts, the first wing portion comprises a first hole.

In another aspect, a jig according to one or more embodiments of the present disclosure may comprise a pair of side parts facing each other, holders formed at inner portions of the pair of side parts, the holders being protruded and facing each other, a first frame configured to interconnect at least portions of upper portions of the pair of side parts, and a second frame configured to interconnect at least portions of lower portions of the pair of side parts, the holders are formed along an oblique or diagonal direction with respect to the pair of side parts.

In another aspect, a jig assembly including a plurality of vertically stackable jigs, the jig may comprise a first jig disposed at a lower portion, and a second jig disposed at an upper portion, each of the first jig and the second jig comprises a pair of side parts facing each other, holders formed at inner portions of the pair of side parts, the holders being protruded and facing each other, a first frame configured to interconnect at least portions of upper portions of the pair of side parts, a second frame configured to interconnect at least portions of lower portions of the pair of side parts, a first wing portion attached to the upper portions of each of the pair of side parts at an outside of the pair of side parts, and a second wing portion attached to the lower portions of each of the pair of side parts at the outside of the pair of side parts. The first wing portion may comprise a first hole, and the second wing portion may comprise a second hole, the first hole of the first jig and the second hole of the second jig communicate with each other. The jig assembly may further comprise a fixing member configured to fasten the first hole of the first jig and the second hole of the second jig to each other.

In another aspect, an apparatus for electroless plating according to one or more embodiments of the present disclosure may include a jig and a plurality of cartridge assemblies, the jig may comprise a pair of side parts facing each other; holders formed at inner portions of the pair of side parts, the holders being protruded and facing each other; a first frame configured to interconnect at least portions of upper portions of the pair of side parts; and a second frame configured to interconnect at least portions of lower portions of the pair of side parts, the plurality of cartridge assemblies are disposed at the holders of the jig.

A cartridge for electroless plating and the jig thereof according to one or more embodiments of the present disclosure may form an electrode such that the electrode can be vertically separated, without masking. An electrode portion may be uniformly formed by the jig which has a vertically opened structure.

When a vibrator is configured using an electrode portion prepared by a cartridge assembly and a jig according to one or more embodiments of the present disclosure, a process for mass production may be implemented, and thus, an enhancement in productivity and a reduction in cost (or manufacturing costs) may be achieved. In addition, sound characteristics similar to those obtained when other plating processes are used may be secured.

Other systems, methods, features and advantages will be, or will become, apparent to one with skill in the art upon examination of the following figures and detailed description. It is intended that all such additional systems, methods, features, and advantages be included within this description, be within the scope of the present disclosure, and be protected by the following claims. Nothing in this section should be taken as a limitation on those claims. Further aspects and advantages are discussed below in conjunction with embodiments of the present disclosure.

It is to be understood that both the foregoing description and the following description of the present disclosure are exemplary and explanatory and are intended to provide further explanation of the disclosure as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a further understanding of the present disclosure, are incorporated in, and constitute a part of this disclosure, illustrate embodiments of the disclosure and together with the description serve to explain principles of the present disclosure.

FIG. 1 is a perspective view of a cartridge assembly for electroless plating according to an embodiment of the present disclosure.

FIG. 2A is a plan view of a first cartridge of a cartridge assembly for electroless plating according to an embodiment of the present disclosure.

FIG. 2B is a plan view of a second cartridge of a cartridge assembly for electroless plating according to an embodiment of the present disclosure.

FIG. 3A is a cross-sectional view taken along line I-I′ in FIG. 2A.

FIG. 3B is a cross-sectional view taken along line II-II′ in FIG. 2B.

FIG. 3C is a cross-sectional view taken along line III-III′ in FIG. 1 .

FIG. 4 is a perspective view of a cartridge assembly for electroless plating according to another embodiment of the present disclosure.

FIG. 5A is plan views of a first cartridge of a cartridge assembly for electroless plating according to another embodiment of the present disclosure.

FIG. 5B is plan views of a second cartridge of a cartridge assembly for electroless plating according to another embodiment of the present disclosure.

FIG. 6 is a perspective view of a jig according to an embodiment of the present disclosure.

FIG. 7 is a plan view of a jig according to an embodiment of the present disclosure.

FIG. 8 is a view showing a state in which a cartridge assembly of FIG. 1 is coupled to the jig of FIG. 6 .

FIG. 9 is a perspective view of a jig according to another embodiment of the present disclosure.

FIG. 10 is a view showing a state in which a plurality of jigs according to an embodiment of the present disclosure are vertically stacked and coupled.

FIG. 11 is a perspective view of a jig according to another embodiment of the present disclosure.

FIG. 12 is a perspective view of a jig according to another embodiment of the present disclosure.

FIG. 13 illustrates a jig immersed in a plating apparatus.

FIG. 14 illustrates results of X-ray diffraction analysis of a substrate for electroless plating performed after electroless nickel plating.

FIG. 15 illustrates results of SEM-EDS analysis of a substrate for electroless plating performed after electroless nickel plating.

FIGS. 16A to 16C show photographs of cross-sections of a surface of a silver paste.

FIG. 17A to 17C show photographs of cross-sections of a surface of nickel of a substrate for electroless plating.

FIGS. 18A to 18C show photographs of cross-sections of a surface of copper of a substrate for electroless plating.

FIG. 19 illustrates conditions of an experiment for measuring sound characteristics.

FIG. 20 shows results of measurement of sound characteristics of a vibrator according to an embodiment of the present disclosure.

Throughout the drawings and the detailed description, unless otherwise described, the same drawing reference numerals should be understood to refer to the same elements, features, and structures. The sizes, lengths, and thicknesses of layers, regions and elements, and depiction thereof may be exaggerated for clarity, illustration, and convenience.

DETAILED DESCRIPTION

Reference is now made in detail to embodiments of the present disclosure, examples of which may be illustrated in the accompanying drawings. In the following description, when a detailed description of well-known functions or configurations related to this document is determined to unnecessarily cloud a gist of the inventive concept, the detailed description thereof may be omitted for brevity. The progression of processing steps and/or operations described is an example; however, the sequence of steps and/or operations is not limited to that set forth herein and may be changed, with the exception of steps and/or operations necessarily occurring in a particular order.

Unless stated otherwise, like reference numerals may refer to like elements throughout even when they are shown in different drawings. In one or more aspects, identical elements (or elements with identical names) in different drawings may have the same or substantially the same functions and properties. Names of the respective elements used in the following explanations are selected only for convenience and may be thus different from those used in actual products.

Advantages and features of the present disclosure, and implementation methods thereof, are clarified through the embodiments described with reference to the accompanying drawings. The present disclosure may, however, be embodied in different forms and should not be construed as limited to and embodiments set forth herein. Rather, these embodiments are examples and are provided so that this disclosure may be thorough and complete to assist those skilled in the art to understand the inventive concepts without limiting the protected scope of the present disclosure.

The shapes, sizes, areas, ratios, angles, numbers, and the like disclosed in the drawings for describing embodiments of the present disclosure are merely examples, and thus, the present disclosure is not limited to the illustrated details.

When the term “comprise,” “have,” “include” “contain,” “constitute,” “make up of,” “formed of,” or the like is used, another part may be added unless a term such as “only” or the like is used. The terms used in the present disclosure are merely used in order to describe particular embodiments, and are not intended to limit the scope of the present disclosure. The terms used herein are merely used in order to describe example embodiments, and are not intended to limit the scope of the present disclosure. The terms of a singular form may include plural forms unless referred to the contrary. The word “exemplary” is used to mean serving as an example or illustration. Embodiments are example embodiments. Aspects are example aspects. Any implementation described herein as an “example” is not necessarily to be construed as preferred or advantageous over other implementations.

In one or more aspects, an element, feature, or corresponding information (e.g., a level, range, dimension, size, or the like) is construed as including an error or tolerance range even where no explicit description of such an error or tolerance range is provided. An error or tolerance range may be caused by various factors (e.g., process factors, internal or external impact, noise, or the like). Further, the term “may” encompasses all the meanings of the term “can.”

In describing a positional relationship, where the positional relationship between two parts is described, for example, “on,” “over,” “under,” “above,” “below,” “beneath,” “near,” “close to,” or “adjacent to,” “beside,” “next to,” or the like, one or more other parts may be located between the two parts unless a more limiting term, such as “immediate(ly),” “direct(ly),” or “close(ly),” is used. In the description of embodiments, when a structure is described as being positioned “on,” “over,” “under,” “above,” “below,” “beneath,” “near,” “close to,” or “adjacent to,” “beside,” or “next to” another structure, this description should be construed as including a case in which the structures contact each other as well as a case in which one or more additional structures are disposed therebetween. Furthermore, the terms “front,” “rear,” “back,” “left,” “right,” “top,” “bottom,” “downward,” “upward,” “upper,” “lower,” “up,” “down,” “column,” “row,” “vertical,” “horizontal,” and the like refer to an arbitrary frame of reference.

In describing a temporal relationship, when the temporal order is described as, for example, “after,” “subsequent,” “next,” “before,” “preceding,” “prior to,” or the like a case that is not consecutive or not sequential may be included unless a more limiting term, such as “just,” “immediate(ly),” or “direct(ly),” is used.

It is understood that, although the terms “first,” “second,” or the like may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be a second element, and, similarly, a second element could be a first element, without departing from the scope of the present disclosure. Furthermore, the first element, the second element, and the like may be arbitrarily named according to the convenience of those skilled in the art without departing from the scope of the present disclosure. The terms “first,” “second,” and the like may be used to distinguish components from each other, but the functions or structures of the components are not limited by ordinal numbers or component names in front of the components.

In describing elements of the present disclosure, the term “first,” “second,” “A,” “B,” “(a),” “(b),” or the like may be used. These terms are intended to identify the corresponding element(s) from the other element(s), and these are not used to define the essence, basis, order, or number of the elements.

For the expression that an element or layer is “connected,” “coupled,” or “adhered” to another element or layer, the element or layer can not only be directly connected, coupled, or adhered to another element or layer, but also be indirectly connected, coupled, or adhered to another element or layer with one or more intervening elements or layers disposed or interposed between the elements or layers, unless otherwise specified.

For the expression that an element or layer “contacts,” “overlaps,” or the like with another element or layer, the element or layer can not only directly contact, overlap, or the like with another element or layer, but also indirectly contact, overlap, or the like with another element or layer with one or more intervening elements or layers disposed or interposed between the elements or layers, unless otherwise specified.

The terms such as a “line” or “direction” should not be interpreted only based on a geometrical relationship in which the respective lines or directions are parallel or perpendicular to each other, and may be meant as lines or directions having wider directivities within the range within which the components of the present disclosure can operate functionally.

The term “at least one” should be understood as including any and all combinations of one or more of the associated listed items. For example, the meaning of “at least one of a first item, a second item, and a third item” denotes the combination of items proposed from two or more of the first item, the second item, and the third item as well as only one of the first item, the second item, or the third item.

The expression of a first element, a second elements “and/or” a third element should be understood as one of the first, second and third elements or as any or all combinations of the first, second and third elements. By way of example, A, B and/or C can refer to only A; only B; only C; any or some combination of A, B, and C; or all of A, B, and C. Furthermore, an expression “element A/element B” may be understood as element A and/or element B.

In one or more aspects, the terms “between” and “among” may be used interchangeably simply for convenience unless stated otherwise. For example, an expression “between a plurality of elements” may be understood as among a plurality of elements. In another example, an expression “among a plurality of elements” may be understood as between a plurality of elements. In one or more examples, the number of elements may be two. In one or more examples, the number of elements may be more than two.

In one or more aspects, the phrases “each other” and “one another” may be used interchangeably simply for convenience unless stated otherwise. For example, an expression “different from each other” may be understood as being different from one another. In another example, an expression “different from one another” may be understood as being different from each other. In one or more examples, the number of elements involved in the foregoing expression may be two. In one or more examples, the number of elements involved in the foregoing expression may be more than two.

Features of various embodiments of the present disclosure may be partially or wholly coupled to or combined with each other, and may be variously inter-operated, linked or driven together. The embodiments of the present disclosure may be carried out independently from each other or may be carried out together in a co-dependent or related relationship.

In one or more aspects, the components of each apparatus according to various embodiments of the present disclosure are operatively coupled and configured.

In the following description, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. With respect to reference numerals to elements of each of the drawings, the same elements may be illustrated in other drawings, and like reference numerals may refer to like elements unless stated otherwise. In addition, for convenience of description, a scale, dimension, size, and thickness of each of the elements illustrated in the accompanying drawings may be different from an actual scale, dimension, size, and thickness, and thus, embodiments of the present disclosure are not limited to a scale, dimension, size, and thickness illustrated in the drawings.

FIG. 1 is a perspective view of a cartridge assembly for electroless plating according to an embodiment of the present disclosure. FIG. 2A is a plan view of a first cartridge of a cartridge assembly for electroless plating according to an embodiment of the present disclosure. FIG. 2B is a plan view of a second cartridge of a cartridge assembly for electroless plating according to an embodiment of the present disclosure.

With reference to FIGS. 1, 2A, and 2B, a cartridge assembly 10 for electroless plating according to an embodiment of the present disclosure may include a first cartridge 100 and a second cartridge 200. In addition, a substrate 1 for electroless plating may be disposed between the first cartridge 100 and the second cartridge 200. Hereinafter, the substrate 1 for electroless plating will be simply referred to as “the substrate 1”. Here, the substrate 1 may be a vibration portion of a vibration apparatus configured to receive an electrical signal, thereby generating a vibration signal or a sound signal. For example, the substrate 1 may include an inorganic piezoelectric material, and may be configured by a piezoelectric ceramic having a perovskite-based crystalline structure.

In accordance with an embodiment of the present disclosure, a periphery (or an edge) of the first cartridge 100 and a periphery (or an edge) of the second cartridge 200 may overlap each other and may be spaced apart from each other by a predetermined distance without closely contacting each other. Accordingly, when the substrate 1 according to an embodiment of the present disclosure is subjected to electroless plating, at least a portion of a side surface of the substrate 1 may be exposed to an electroless plating solution, and thus, may be plated. The first cartridge 100 may have a first length L1 in a first direction X and a second length L2 in a second direction Y intersecting (or perpendicularly intersecting) the first length L1. The first length L1 and the second length L2 may be greater than corresponding dimensions of the substrate 1, respectively.

The first cartridge 100 may include an inside (or an inner side or the inner portion) having an opening. The inside (or the inner side or the inner portion) of the first cartridge 100 may have a third length L3 in the first direction X and a fourth length L4 in the second direction Y intersecting (or perpendicularly intersecting) the third length L3. For example, the first cartridge 100 may include a first opening 100 a with the third length L3 and the fourth length L4. For example, the first opening 100 a may have the third length L3 and the fourth length L4.

In accordance with an embodiment of the present disclosure, the third length L3 and the fourth length L4 of the first opening 100 a may define an area in which an upper surface of the substrate 1 is exposed when the cartridge assembly 10 is immersed in the plating solution.

In accordance with an embodiment of the present disclosure, the first cartridge 100 may include a holder 110. The holder 110 may be configured at the first cartridge 100 to face the second cartridge 200. For example, the holder 110 may be formed to protrude from a flat surface of the first cartridge 100 facing the second cartridge 200.

The holder 110 may be configured at one or more of corner portions of the first cartridge 100. The holder 110 may be in the form of L-shape. For example, the holder 110 may be formed at least one of corners of the first cartridge 100 where edges of the first cartridge 100 cross one another. For example, when the first cartridge 100 has a predetermined thickness, and has a structure including the opening 100 a, the holder 110 may be provided at four corners.

In accordance with an embodiment of the present disclosure, the holder 110 may be provided at a position determined by a fifth length L5 in the first direction X and a sixth length L6 in the second direction Y. The fifth length L5 may be greater than the third length L3 and may be smaller than the first length L1. The sixth length L6 may be greater than the fourth length Land may be smaller than the second length L2.

In addition, the difference between the fifth length L5 and the third length L3 may be a first distance d1, and the difference between the sixth length L6 and the fourth length L4 may be a second distance d2. For example, the first distance d1 and the second distance d2 may be 2.5 to 3.0 mm. When the first distance d1 is beyond a range of 2.5 to 3.0 mm, for example, when the first distance d1 is less than 2.5 mm, a portion of the upper surface of the substrate 1, at which no plating is formed, has an excessively small width.

When the plating solution penetrates between the upper surface of the substrate 1 and the first cartridge 100 due to process errors, the width of the portion of the upper surface of the substrate 1, at which no plating is formed, may be further reduced. The process errors or tolerance range may include tolerance caused by manufacture of the upper cartridge 100, tolerance of a position at which the holder 110 of the upper cartridge 100 is formed, etc. In addition, a plating layer formed at the upper surface of the substrate 1 and a plating layer formed at a side surface of the substrate 1 may be interconnected, and thus, it might be difficult to separate the plating layer formed at the side surface of the substrate 1 from the plating layer formed at the upper surface of the substrate 1 so as to form an electrode.

In accordance with an embodiment of the present disclosure, the first distance d1 and the second distance d2 may be widths of an area, in which no plating is formed, at each corner of the substrate 1.

The second cartridge 200 may have a seventh length L7 in the first direction X and an eighth length L8 in the second direction Y intersecting (or perpendicularly intersecting) the seventh length L7.

The second cartridge 200 may include an inside (or an inner side or the inner portion) having an opening. The inside (or the inner side or the inner portion) of the second cartridge 200 may have, at an inside thereof, a ninth length L9 in the first direction X and a tenth length L10 in the second direction Y intersecting (or perpendicularly intersecting) the ninth length L9. The second cartridge 200 may be provided with a second opening 200 a defined by the ninth length L9 and the tenth length L10.

In accordance with an embodiment of the present disclosure, the ninth length L9 and the tenth length L10 of the second opening 200 a may define an area in which a lower surface of the substrate 1 is exposed when the cartridge assembly 10 is immersed in the plating solution.

In accordance with an embodiment of the present disclosure, the second cartridge 200 may include a holder accommodating portion 210 provided to receive the holder 110 of the first cartridge 100 (hereinafter referred to as “the first cartridge holder 110”). The holder accommodating portion 210 may be a receiver or accommodating portion, but, embodiments of the present disclosure is not limited.

The holder accommodating portion 210 may be configured at one or more of corner portions of the second cartridge 200. The holder accommodating portion 210 may be in the form of L shape. For example, the holder accommodating portion 210 may be formed at least one of corners of the second cartridge 200 where edges of the second cartridge 200 cross one another. For example, when the second cartridge 200 has a predetermined thickness, and has a structure including the second opening 200 a, the holder accommodating portion 210 may be provided at four corners.

In accordance with an embodiment of the present disclosure, the holder accommodating portion 210 may be provided at a position determined by an eleventh length L11 in the first direction X and a twelfth length L12 in the second direction Y. The eleventh length L11 may be greater than the ninth length L9 and may be smaller than the seventh length L7. The twelfth length L12 may be greater than the tenth length L10 and may be smaller than the eighth length L8.

In addition, the difference between the eleventh length L11 and the ninth length L9 may be a third distance d3, and the difference between the twelfth length L12 and the tenth length L10 may be a fourth distance d4. For example, the third distance d3 and the fourth distance d4 may be 2.5 mm to 3.0 mm, but embodiments of the present disclosure are not limited thereto.

When the third distance d3 is beyond a range of 2.5 to 3.0 mm, for example, when the third distance d3 is less than 2.5 mm, a portion of the lower surface of the substrate 1, at which no plating is formed, has an excessively small width. When the plating solution penetrates between the lower surface of the substrate 1 and the second cartridge 200 due to process errors or tolerance range, the width of the portion of the lower surface of the substrate 1, at which no plating is formed, may be further reduced. The process errors or tolerance range may include tolerance caused by manufacture of the lower cartridge 200, tolerance of a position at which the holder accommodating portion 210 of the lower cartridge 200 is formed, etc.

In addition, a plating layer formed at the lower surface of the substrate 1 and the plating layer formed at the side surface of the substrate 1 may be interconnected, and thus, it might be difficult to separate the plating layer formed at the side surface of the substrate 1 the plating layer formed at the lower surface of the substrate 1 so as to from an electrode.

In addition, in accordance with an embodiment of the present disclosure, the upper surface and the lower surface of the substrate 1 of the cartridge assembly 10 may be plated only in areas thereof respectively exposed by the first opening 100 a and the second opening 200 a. In this case, an area where the upper surface of the substrate 1 and the first cartridge 100 overlap each other and an area where the lower surface of the substrate 1 and the second cartridge 200 overlap each other may not be electrolessly plated.

In addition, in the present disclosure, when the substrate 1 is immersed in the plating solution in a state of being coupled to the cartridge assembly 10, it may be unnecessary to perform separate masking by a masking member (or a masking tape) at the side surface of the substrate 1.

As described with reference to FIG. 1 , the first cartridge 100 and the second cartridge 200 may have structures capable of being fastened to each other by the holder 100 and the holder accommodating portion 210. Accordingly, the first length L1 and the seventh length L7 may have the same length. The second length L2 and the eighth length L8 may have the same length. The third length L3 and the ninth length L9 may have the same length. The fourth length L4 and the tenth length L10 may have the same length. The fifth length L5 and the eleventh length L11 may have the same length. The sixth length L6 and the twelfth length L12 may have the same length.

FIG. 3A is a cross-sectional view taken along line I-I′ in FIG. 2A. FIG. 3B is a cross-sectional view taken along line II-II′ in FIG. 2B. FIG. 3C is a cross-sectional view taken along line III-III′ in FIG. 1 .

With reference to FIGS. 3A and 3B, the first cartridge 100 may have a first thickness t1. The holder 110 may have a first height h1 and a first width W1. The second cartridge 200 may have a second thickness t2. The holder accommodating portion 210 may have a second height h2 and a second width W2.

With reference to FIG. 3C, the holder 110 is shown as being fastened to the holder accommodating portion 210 such that the holder 110 completely engages with the holder accommodating portion 210, but the first width W1 according to an embodiment of the present disclosure may be smaller than the second width W2. For example, when the first width W1 is set to 5.0 mm, the second width W2 may be set to 4.9 mm, but the content and the claims of the present disclosure are not limited thereto.

In addition, with reference to FIG. 3C, the substrate 1 may be disposed between the first cartridge 100 and the second cartridge 200. Accordingly, the first height h1 of the holder 110 may be greater than the second height h2 of the holder accommodating portion 210. The first height h1 of the holder 110 may be set to be equal to or greater than a sum of the second height h2 of the holder accommodating portion 210 and the thickness of the substrate 1. For example, when the first height h1 of the holder 110 is set to 0.4 mm, the second height h2 of the holder accommodating portion 21 may be set to 0.2 mm, but embodiments of the present disclosure are not limited thereto.

In accordance with an embodiment of the present disclosure, the first cartridge 100 and the second cartridge 200 may include Teflon. When the first cartridge 100 and the second cartridge 200 include Teflon, the first cartridge 100 and the second cartridge 200 may have low surface tension characteristics (20 dynes/cm). As such, it may be possible to prevent the plating solution from being plated on the first cartridge 100 and the second cartridge 200 in accordance with low surface tension characteristics. In addition, the Teflon may have a density of 98% or more. When the Teflon has a density of less than 98%, air pores may be formed, and thus, degradation in surface tension characteristics may occur. Furthermore, when the first cartridge 100 and the second cartridge 200 are not constituted by the Teflon, the plating solution may penetrate into an empty space between the first cartridge 100 and the second cartridge 200, when it is assumed that the cartridge assembly 10 is immersed in a plating bath or a plating apparatus such that the cartridge assembly 10 is immersed in the plating solution, after the first cartridge 100 and the second cartridge 200 are fastened to each other as illustrated in FIG. 3C. In this case, the side surface of the substrate 1 may be plated, or portions of the substrate 1, the first cartridge 100 and the second cartridge 200 may be bonded to one another. Accordingly, the first cartridge 100 and the second cartridge 200 may be constituted by a material having low surface tension characteristics. For example, the first cartridge 100 and the second cartridge 200 may be constituted by the Teflon.

FIG. 4 is a perspective view of a cartridge for electroless plating according to another embodiment of the present disclosure. FIG. 5A is plain view of a first cartridge of a cartridge for electroless plating according to another embodiment of the present disclosure. FIG. 5B is plain view of a second cartridge of a cartridge for electroless plating according to another embodiment of the present disclosure. The cartridge for electroless plating of FIG. 4 may include the same configuration as the cartridge for electroless plating of FIG. 1 , except that dimensions or lengths in the first direction X and the second direction Y are changed (or modified).

With reference to FIGS. 4, 5A, and 5B, the cartridge assembly 10 for electroless plating according to another embodiment of the present disclosure may include a first cartridge 100 and a second cartridge 200. In addition, a substrate 1 for electroless plating may be disposed between the first cartridge 100 and the second cartridge 200.

As described above, the cartridge for electroless plating of FIG. 4 may include the same configuration as the cartridge for electroless plating of FIG. 1 , except that the dimensions or lengths in the first direction X and the second direction Y are changed (or modified).

First to sixth lengths L1 to L6 of the first cartridge 100 of FIG. 5A may be smaller than the first to sixth lengths L1 to L6 of the first cartridge 100 of FIG. 2A, respectively. Seventh to twelfth lengths L7 to L12 of the second cartridge 200 of FIG. 5B may be smaller than the seventh to twelfth lengths L7 to L12 of the first cartridge 100 of FIG. 2B, respectively.

In addition, the cross-sectional structure of the first cartridge 100 taken along line I-I′ in FIG. 5A is identical to the cross-sectional structure of the first cartridge of the cartridge for electroless plating according to an embodiment of the present disclosure of FIG. 3A. The cross-sectional structure of the second cartridge 200 taken along line II-II′ in FIG. 5B is identical to the cross-sectional structure of the second cartridge of the cartridge for electroless plating according to an embodiment of the present disclosure of FIG. 3B. The cross-sectional structure of the cartridge for electroless plating according to another embodiment of the present disclosure taken along line III-III′ in FIG. 4 is identical to the cross-sectional structure of the cartridge for electroless plating according to an embodiment of the present disclosure of FIG. 3C.

FIG. 6 is a perspective view of a jig according to an embodiment of the present disclosure. FIG. 7 is a plan view of a jig according to an embodiment of the present disclosure. FIG. 8 is a view showing a state in which a cartridge of FIG. 1 is coupled to a jig of FIG. 6 .

With reference to FIG. 6 , a jig 20 according to an embodiment of the present disclosure may include side parts 21, holders 22 formed at the side parts 21 such that the holders 22 protrude while facing each other, a first frame 23 configured to interconnect the side parts 21 at upper portions of the side parts 21, a second frame 24 configured to interconnect the side parts 21 at lower portions of the side parts 21, a pair of first wings 25 attached to upper portions and side surfaces of the side parts 21, and a pair of second wings 26 attached to lower portions and the side surfaces of the side parts 21. In addition, each of the first wings 25 may include a first coupling hole 25 a allowing an appropriate tool to be coupled (or connected) thereto when the jig 20 is immersed in a plating bath, for electroless plating, or is removed from the plating bath, the holders 22 may be cartridge holders, but embodiments of the present disclosure are not limited thereto.

In accordance with an embodiment of the present disclosure, the jig 20 may further include a dummy area DA between the first frame 23 and the holders 22. The jig 20 according to an embodiment of the present disclosure may include the dummy area DA, and thus, a plating solution may be smoothly circulated in the jig 20, thereby increasing the electroless plating efficiency.

With reference to FIG. 8 , a plurality of cartridges 10 may be engaged among the holders 22, respectively.

In accordance with an embodiment of the present disclosure, the configurations included in the jig 20 may be constituted by the Teflon. When the jig 20 includes the Teflon, the jig 20 may have low surface tension characteristics (20 dynes/cm). As such, it may be possible to prevent a plating solution from being plated on the jig 20 in accordance with low surface tension characteristics. In addition, the Teflon may have a density of 98% or more. When the Teflon has a density of less than 98%, air pores may be formed, and thus, degradation in surface tension characteristics may occur. Furthermore, the plating solution may penetrate into an empty space between the cartridge assembly 10 and the holder 22, when it is assumed that the jig 20 is immersed in a plating bath or a plating apparatus such that the jig 20 is immersed in the plating solution, after the cartridge assembly 10 is engaged with the holder 22 as illustrated in FIG. 8 . In this case, portions of the cartridge assembly 10 and the jig 20 may be bonded to one another due to the plating solution. Accordingly, the cartridge assembly 10 and the jig 20 may be constituted by a material having low surface tension characteristics. For example, the cartridge assembly 10 and the jig 20 may be constituted by the Teflon.

FIG. 9 is a perspective view of a jig according to another embodiment of the present disclosure. FIG. 10 is a view showing a state in which a plurality of jigs according to an embodiment of FIG. 9 is vertically stacked and coupled.

With reference to FIG. 9 , the jig according to an embodiment of the present disclosure may further include a second hole 26 a at a second wing 26. The jig according to an embodiment of the present disclosure in FIG. 9 is identical to the jig of FIG. 6 , except that the second hole 26 a is formed at the second wing 26, and thus, repetitive description thereof may be omitted.

With reference to FIG. 10 , the plurality of jigs according to an embodiment of the present disclosure may be vertically stacked, and a second hole 26 a of a lower jig and a first hole 25 a of an upper jig may be aligned with each other such that the second hole 26 a and the first hole 25 a communicate with each other. A fixing member (or a fastening member) 27 may be disposed at the second hole 26 a of a lower one of the plurality of jigs and the first hole 25 a of an upper one of the plurality of jigs, which communicate with each other, and thus, may fasten the upper jig and the lower jig to each other. If necessary, a fixing state (or fastened state) of the upper jig and the lower jig may be released. For example, the fixing member 27 may include a first fixing member 27-1 and a second fixing member 27-2. The first fixing member 27-1 and the second fixing member 27-2 may be members or elements configured to be fastened to each other, thereby fastening the upper jig and the lower jig to each other. For example, the first fixing member 27-1 and the second fixing member 27-2 may include at least one or more of a bolt, a nut, and a screw, but embodiments of the present disclosure are not limited thereto.

In addition, as illustrated in FIG. 10 , two jigs may be coupled to each other, and thus, may be referred to as a “jig assembly”.

According to an embodiment of the present disclosure, the jig assembly which includes a plurality of vertically stackable jigs may include a first jig disposed at a lower side (or a lower portion) and a second jig disposed at an upper side (or an upper portion). Each of the first jig and the second jig may include a pair of side parts facing each other, cartridge holders (or holders) formed at insides (or inner portions) of the side parts such that the cartridge holders protrude to face each other, a first frame configured to interconnect at least portions of upper portions of the side parts, a second frame configured to interconnect at least portions of lower portions of the side parts, a first wing portion attached to the upper portions of each of the pair of side parts at an outside of the pair of side parts, and a second wing portion attached to the lower portions of each of the pair of side parts at the outside of the pair of side parts. The first wing portion may include a first hole, the first wing portion may include a second hole. The first hole of the first jig and the second hole of the second jig may be communicated with each other. The jig assembly may further include a fixing member configured to fix (or fasten) the first hole of the first jig and the second hole of the second jig to each other.

FIG. 11 is a perspective view of a jig according to another embodiment of the present disclosure.

With reference to FIG. 11 , the jig 20 according to another embodiment of the present disclosure may include side parts 21, cartridge holders (or holders) 22 formed at the side parts 21 such that the cartridge holders 22 protrude to face each other, a first frame 23 configured to interconnect the side parts 21 at upper portions of the side parts 21, and a second frame 24 configured to interconnect the side parts 21 at lower portions of the side parts 21. In the jig 20 according to another embodiment of the present disclosure, a cartridge assembly 10 may be disposed along an oblique or diagonal direction, and thus, in the jig 20 according to another embodiment of the present disclosure, a plating solution may be easily introduced into and discharged from the jig 20 when the jig 20 is immersed in an electroless plating bath, thereby enhancing the electroless plating efficiency.

The jig 20 according to another embodiment of the present disclosure may include a pair of side parts 21 facing each other, cartridge holders (or holders) 22 formed at insides (or inner portions) of the side parts 21 such that the cartridge holders 22 protrude to face each other, a first frame 23 configured to interconnect at least portions of upper portions of the side parts 21, and a second frame 24 configured to interconnect at least portions of lower portions of the side parts 21. The cartridge holders (or the holders) 22 may be formed along an oblique or diagonal direction with respect to the side parts 21.

FIG. 12 is a perspective view of a jig according to another embodiment of the present disclosure.

With reference to FIG. 12 , the jig 20 according to another embodiment of the present disclosure may include side parts 21, cartridge holders (or holders) 22 formed at the side parts 21 such that the cartridge holders 22 protrude to face each other, a first frame 23 configured to interconnect the side parts 21 at upper portions of the side parts 21, and a second frame 24 configured to interconnect the side parts 21 at lower portions of the side parts 21. In the jig according to another embodiment of the present disclosure, cartridges 10 may be disposed in a zigzag manner when viewed in plan view, and thus, a plating solution may be easily introduced into and discharged from the jig 20 when the jig 20 is immersed in an electroless plating bath, thereby enhancing the electroless plating efficiency.

The jig 20 according to another embodiment of the present disclosure may include a pair of side parts 21 facing each other, cartridge holders (or holders) 22 formed at insides (or inner portions) of the side parts 21 such that the cartridge holders 22 protrude to face each other, a first frame 23 configured to interconnect at least portions of upper portions of the side parts 21, and a second frame 24 configured to interconnect at least portions of lower portions of the side parts 21. The cartridge holders (or the holders) 22 may be formed along an oblique or diagonal direction with respect to the side parts 21.

FIG. 13 illustrates a jig immersed in a plating apparatus.

With reference to FIG. 13 , the plating apparatus 30 may include a plating solution 40 filled at a predetermined level, and jigs may be stacked to be immersed in the plating solution 40. For example, the above-described structure of FIG. 10 may be applied to a plurality of jigs 20 stacked in the plating solution 40.

FIG. 14 illustrates results of X-ray diffraction analysis of a substrate for electroless plating performed after electroless nickel plating. In FIG. 14 , a dotted line represents that nickel % (wt %) by mass in a plating solution is 8.7%, a dash-dotted line represents that nickel % (wt %) by mass in a plating solution is 11.4%, and a solid line represents that nickel % (wt %) by mass in a plating solution is 13.9%.

In FIG. 14 , an abscissa axis represents a diffraction angle (2 θ), and an ordinate axis represents an X-ray diffraction intensity (optional unit).

With reference to FIG. 14 , it can be seen that a diffraction peak in a (111) orientation of nickel (Ni) was observed in a measurement range of 35 to 550 under conditions of each plating solution. Accordingly, it can be seen that, when electroless nickel plating is performed on a substrate for electroless plating under conditions of each nickel plating solution, a nickel layer usable as an electrode portion is formed on the substrate for electroless plating. In addition, it can be seen that, as the nickel % by mass in an electroless plating solution varied in nickel % by mass increases, the intensity of the diffraction peak in a (111) orientation of nickel (Ni) is increased.

FIG. 15 illustrates results of SEM-EDS analysis of a substrate for electroless plating performed after electroless nickel plating.

In FIG. 15 , an abscissa axis represents an acceleration voltage of an electron beam in scanning electron microscope/energy-dispersive X-ray spectroscopy (SEM-EDS), and an ordinate axis represents the number of characteristic X-rays measured in an acceleration energy range at the horizontal axis by an electron beam.

With reference to FIG. 15 , it can be seen, from results of the AEM-EDS analysis, that nickel (Ni) and phosphorous (P) are observed at a surface of a substrate 1 for electroless plating.

The following Expression 1 is a reaction formula of electroless nickel plating using sodium hypophosphite (NaH₂PO₂) as a reducing agent.

With reference to Expression 1, nickel (Ni), phosphorous (P), sodium sulfate (Na₂SO₄), and monosodium phosphite (NaH₂PO₃) are finally formed. Here, nickel (Ni) and phosphorous (P) may be elements plated on the surface of the substrate 1 for electroless plating. Accordingly, results of the analysis of FIG. 15 meet Expression 1.

FIG. 16A is a photograph of a surface of a silver paste photographed before execution of screen printing. FIG. 16B is a photograph of a surface of a silver paste photographed after execution of screen printing. FIG. 16C is a photograph of a cross-section of the silver paste after execution of screen printing. FIG. 17A is a photograph of a surface of a substrate for plating before execution of plating. FIG. 17B is a photograph of a surface of a substrate electrolessly plated with nickel after execution of plating. FIG. 17C is a photograph of a cross-section of the substrate electrolessly plated with nickel after execution of plating. FIG. 18A is a photograph of a surface of a substrate for plating before execution of plating. FIG. 18B is a photograph of a surface of a substrate electrolessly plated with copper after execution of plating. FIG. 18C is a photograph of a cross-section of the substrate electrolessly plated with copper after execution of plating.

In FIGS. 16A to 18C, the surface photographs of FIGS. 16A, 17A, and 18A were obtained through photographing using a digital camera. The surface photographs of FIGS. 16B, 17B, and 18B were obtained through photographing using a focused ion beam scanning electron microscopy (FIB-SEM) at a magnification of 500 times. The cross-section photographs of FIGS. 16C, 17C, and 18C were obtained through photographing using a focused ion beam scanning electron microscopy (FIB-SEM) at a magnification of 7,000 times.

The substrates for electroless plating in FIGS. 16A to 18C, lead zirconate titanate (PZT) sintered bodies were prepared.

With reference to FIGS. 16A, 16B, and 16C, it was measured that the silver paste had a thickness of 5 m, a contact resistance of 0.001 mΩ, and a surface resistance of 80 mΩ. With reference to FIGS. 17A, 17B, and 17C, it can be seen that nickel was well electrolessly plated on the surface of the substrate for plating, and the thickness thereof was measured to be about 0.6 m. In addition, it was measured that the substrate electrolessly plated with nickel had a contact resistance of 0.026 mΩ and a surface resistance of 160 mΩ. With reference to FIGS. 18A, 18B, and 18C, it can be seen that nickel was well electrolessly plated on the surface of the substrate for electroless plating, and the thickness thereof was measured to be about 0.3 m. In addition, it was measured that the substrate electrolessly plated with copper had a contact resistance of 0.045 mΩ. The surface resistance of the substrate was not measured because the surface resistance is very low.

With reference to results of FIGS. 16A to 18C, interfacial characteristics may be important in an electrode plated or screen-printed on a substrate (a PZT sintered body) for electroless plating. Through a contact resistance as interfacial characteristics of an electrode layer plated on a substrate (a PZT sintered body) for electroless plating, it may be possible to roughly estimate expected states of the substrate and the plated electrode layer. With reference to a contact resistance of electroless nickel plating lower than that of electroless copper plating, nickel may exhibit better interfacial characteristics than copper. It was then measured that a silver paste electrode exhibits a low contact resistance of 0.001 mΩ, as compared to those of electroless nickel plating and electroless copper plating.

In addition, for the prepared plated substrate, poling was performed, and a piezoelectric constant d₃₃ was measured. Poling was performed for about 10 minutes at a temperature of 100° C. under application of a voltage of 1.2 kV. It was measured that a piezoelectric constant in electroless nickel plating was 382, a piezoelectric constant in electroless copper plating was 385, and a piezoelectric constant in paste screen printing was 384. The piezoelectric constants have similar values irrespective of electrode formation conditions.

FIG. 19 illustrates conditions of an experiment for measuring sound characteristics.

With reference to FIG. 19 , a sound output characteristic may be measured by a sound analysis equipment. The sound output characteristic has been measured by a B&K audio measurement equipment. The sound analysis equipment may include a sound card which transmits or receives a sound to or from a control personal computer (PC) 70, an amplifier 80 which amplifies a signal generated from the sound card and transfers the amplified signal to a vibration apparatus, and a microphone 60 which collects a sound generated by the vibration apparatus in a display panel 40. For example, the microphone 60 may be disposed at a center of the vibration apparatus 50, and a distance d between the display panel 40 and the microphone 60 may be 50 cm. A sound may be measured under a condition where the microphone 60 is vertical to the vibration apparatus 50. The sound collected through the microphone 60 may be input to the control PC through the sound card, and a control program may check the input sound to analyze a sound of the vibration apparatus. For example, a frequency response characteristic corresponding to a frequency range of 20 Hz to 20 kHz may be measured by using a pulse program.

In accordance with an embodiment of the present disclosure, a vibration apparatus 50 may be a piezoelectric speaker including an inorganic piezoelectric material. For example, the vibration apparatus 50 may be a flexible vibration generator, a flexible actuator, a flexible speaker, a flexible piezoelectric speaker, a film actuator, a film-type piezoelectric composite actuator, a film speaker, a film-type piezoelectric speaker, or a film-type piezoelectric composite, etc. The vibration apparatus 50 may include a vibration portion, a first electrode portion disposed at a first surface of the vibration portion, a second electrode portion disposed at a second surface opposite to the first surface of the vibration portion. The vibration apparatus 50 may further include protection members respectively disposed at both surfaces of the vibration portion to protect both surfaces of the vibration portion.

FIG. 20 shows results of measurement of sound characteristics of a vibration apparatus according to an embodiment of the present disclosure. Sound characteristics indicated by a dotted line in FIG. 20 correspond to the case in which first and second electrode portions of a vibration apparatus are prepared through electroless nickel plating. Sound characteristics indicated by a dash-dotted line in FIG. 20 correspond to the case in which first and second electrode portions of a vibration apparatus are prepared through copper plating. Sound characteristics indicated by a solid line in FIG. 20 correspond to the case in which first and second electrode portions of a vibration apparatus are prepared by silver paste electrodes. The vibration apparatuses were configured under the same conditions, except for conditions for formation of the electrode portions. In FIG. 20 , an abscissa axis represents a frequency in hertz (Hz), and an ordinate axis represents a sound pressure level SPL in decibels (dB).

With reference to FIG. 20 , it can be seen that, in the case of the vibrating part prepared through electroless nickel plating, a high sound value of about 2 dB to 5 dB was measured at 200 Hz or less, and sound characteristics similar to those of the copper-plated electrode and the silver paste electrode were exhibited in a high-mid frequency band of 1,000 Hz to 10,000 Hz. For example, when a nickel electrode is prepared through electroless plating, mass production may be possible using the cartridge and the jig of the present disclosure, and material costs may be reduced because a raw material is relatively inexpensive. The silver paste electrode should be manufactured in an individual manner through a screen printing process, etc., and a raw material thereof may be relatively expensive. For example, when an electrode portion of a vibrator is formed through electroless nickel plating, there is an effect of reducing material costs and process costs by about 50%, as compared to the case in which the electrode portion of the vibrator is constituted by a silver paste electrode.

A vibration apparatus according to one or more embodiments of the present disclosure including electrode portions configured by a cartridge assembly and a jig according to an embodiment of the present disclosure may be applied to a vibration generating apparatus disposed in an apparatus. An apparatus according to an embodiment of the present disclosure may be applied to mobile apparatuses, video phones, smart watches, watch phones, wearable apparatuses, foldable apparatuses, rollable apparatuses, bendable apparatuses, flexible apparatuses, curved apparatuses, sliding apparatuses, variable apparatuses, electronic organizers, electronic books, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, mobile medical devices, desktop personal computers (PCs), laptop PCs, netbook computers, workstations, navigation apparatuses, automotive navigation apparatuses, automotive display apparatuses, automotive apparatuses, theater apparatuses, theater display apparatuses, TVs, wall paper display apparatuses, signage apparatuses, game machines, notebook computers, monitors, cameras, camcorders, and home appliances, or the like. Also, the vibration apparatus according to some embodiments of the present disclosure may be applied to organic light-emitting lighting apparatuses or inorganic light-emitting lighting apparatuses. When the vibration apparatus according to some embodiments of the present disclosure is applied to lighting apparatuses, the lighting apparatuses may act as lighting and a speaker. Also, when the vibration apparatus according to some embodiments of the present disclosure is applied to a mobile device, or the like, the vibration apparatus may be one or more of a speaker, a receiver, and a haptic device, but embodiments of the present disclosure are not limited thereto.

A cartridge assembly for electroless plating and a jig thereof according to one or more embodiments of the present disclosure are described below.

A cartridge according to one or more embodiments of the present disclosure may comprise a first cartridge, and a second cartridge, the first cartridge may comprise a holder disposed at a corner thereof, and the holder may be formed to protrude toward the second cartridge, and the second cartridge may comprise an accommodating portion disposed at a corner thereof, and the accommodating portion may accommodate at least a portion of the holder.

According to one or more embodiments of the present disclosure, the first cartridge may comprise a first opening, the first opening having a smaller dimension than the first cartridge, and the second cartridge may comprise a second opening, the second opening having a smaller dimension than the second cartridge.

According to one or more embodiments of the present disclosure, the first cartridge and the second cartridge may comprise Teflon.

According to one or more embodiments of the present disclosure, the holder may have a first width, and the accommodating portion may have a second width; and the first width may be smaller than the second width.

According to one or more embodiments of the present disclosure, the holder may have a first height, and the accommodating portion may have a second height; and the first height may be greater than the second height.

According to one or more embodiments of the present disclosure, the holder may be disposed at a position spaced apart from the first opening by 2.5 mm to 3.0 mm.

According to one or more embodiments of the present disclosure, the holder and the accommodating portion may be in the form of L shape.

A jig according to one or more embodiments of the present disclosure may comprise a pair of side parts facing each other; holders formed at inner portions of the pair of side parts, the holders being protruded and facing each other; a first frame configured to interconnect at least portions of upper portions of the pair of side parts; a second frame configured to interconnect at least portions of lower portions of the pair of side parts; a first wing portion attached to the upper end of each of the pair of side parts at an outside of the pair of side parts; and a second wing portion attached to the lower portions of each of the side parts at the outside of the pair of side parts, the first wing portion may comprise a first hole.

According to one or more embodiments of the present disclosure, the jig may comprise Teflon.

According to one or more embodiments of the present disclosure, the jig may further comprise a dummy area between the first frame and the holders.

According to one or more embodiments of the present disclosure, the second wing portion may comprise a second hole.

A jig according to one or more embodiments of the present disclosure may comprise a pair of side parts facing each other; holders formed at inner portions of the pair of side parts, the holders being protruded and facing each other; a first frame configured to interconnect at least portions of upper portions of the pair of side parts; and a second frame configured to interconnect at least portions of lower portions of the pair of side parts, the holders may be formed along an oblique or diagonal direction with respect to the pair of side parts.

According to one or more embodiments of the present disclosure, the jig may comprise Teflon.

A jig assembly according to one or more embodiments of the present disclosure may include a plurality of vertically stackable jigs, the jig may comprise a first jig disposed at a lower portion; and a second jig disposed at an upper portion, each of the first jig and the second jig may comprise a pair of side parts facing each other; holders formed at inner portions of the pair of side parts, the holders being protruded and facing each other; a first frame configured to interconnect at least portions of upper portions of the pair of side parts; a second frame configured to interconnect at least portions of lower portions of the pair of side parts; a first wing portion attached to the upper portions of each of the pair of side parts at an outside of the pair of side parts; and a second wing portion attached to the lower portions of each of the pair of side parts at the outside of the pair of side parts, the first wing portion may comprise a first hole, and the second wing portion comprises a second hole, the first hole of the first jig and the second hole of the second jig may communicate with each other, and the jig assembly may further comprise a fixing member configured to fix the first hole of the first jig and the second hole of the second jig to each other.

According to one or more embodiments of the present disclosure, the fixing member may comprise a first fixing member and a second fixing member configured to be fastened to each other or to be separated from each other.

According to one or more embodiments of the present disclosure, the first jig and the second jig may comprise Teflon.

An apparatus for electroless plating according to one or more embodiments of the present disclosure may include a jig and a plurality of cartridge assemblies, the jig may comprise a pair of side parts facing each other; holders formed at inner portions of the pair of side parts, the holders being protruded and facing each other; a first frame configured to interconnect at least portions of upper portions of the pair of side parts; and a second frame configured to interconnect at least portions of lower portions of the pair of side parts, the plurality of cartridge assemblies may be disposed at the holders of the jig.

According to one or more embodiments of the present disclosure, the plurality of cartridge assemblies may be disposed at the holders in a zigzag manner with respect to the pair of side parts.

According to one or more embodiments of the present disclosure, the plurality of cartridge assemblies may be disposed at the holders along an oblique or diagonal direction with respect to the pair of side parts.

It will be apparent to those skilled in the art that various modifications and variations can be made in a cartridge assembly, a jig, a jig assembly, an apparatus for electroless plating of the present disclosure without departing from the technical idea or scope of the present disclosure. Thus, it is intended that the present disclosure covers the modifications and variations of this disclosure provided they come within the scope of the appended claims and their equivalents. 

What is claimed is:
 1. A cartridge assembly, comprising: a first cartridge; and a second cartridge, wherein the first cartridge comprises a holder disposed at a corner thereof, and the holder is formed to extend toward the second cartridge, and wherein the second cartridge comprises an accommodating portion disposed at a corner thereof, and the accommodating portion accommodates at least a portion of the holder.
 2. The cartridge assembly of claim 1, wherein: the first cartridge comprises a first opening, the first opening having a smaller dimension than the first cartridge; and the second cartridge comprises a second opening, the second opening having a smaller dimension than the second cartridge.
 3. The cartridge assembly of claim 1, wherein the first cartridge and the second cartridge comprise Teflon.
 4. The cartridge assembly of claim 1, wherein: the holder has a first width, and the accommodating portion has a second width; and the first width is smaller than the second width.
 5. The cartridge assembly of claim 1, wherein: the holder has a first height, and the accommodating portion has a second height; and the first height is greater than the second height.
 6. The cartridge assembly of claim 2, wherein the holder is disposed at a position spaced apart from the first opening by 2.5 mm to 3.0 mm.
 7. The cartridge assembly of claim 1 wherein the holder and the accommodating portion are in the form of L-shape.
 8. A jig, comprising: a pair of side parts facing each other; holders formed at inner portions of the pair of side parts, the holders being protruded and facing each other; a first frame configured to interconnect at least portions of upper portions of the pair of side parts; a second frame configured to interconnect at least portions of lower portions of the pair of side parts; a first wing portion attached to the upper portions of each of the pair of side parts at an outside of the pair of side parts, the first wing portion including a first hole; and a second wing portion attached to the lower portions of each of the pair of side parts at the outside of the pair of side parts.
 9. The jig of claim 8, wherein the jig comprises Teflon.
 10. The jig of claim 8, further comprising: a dummy area between the first frame and the holders.
 11. The jig of claim 8, wherein the second wing portion comprises a second hole.
 12. A jig, comprising: a pair of side parts facing each other; holders formed at inner portions of the pair of side parts, the holders being protruded and facing each other; a first frame configured to interconnect at least portions of upper portions of the pair of side parts; and a second frame configured to interconnect at least portions of lower portions of the pair of side parts, wherein the holders are formed along an oblique or diagonal direction with respect to the pair of side parts.
 13. The jig of claim 12, wherein the jig comprises Teflon.
 14. A jig assembly including a plurality of vertically stackable jigs, the jig comprising: a first jig disposed at a lower portion; and a second jig disposed at an upper portion, wherein each of the first jig and the second jig comprises: a pair of side parts facing each other; holders formed at inner portions of the pair of side parts, the holders protrude and facing each other; a first frame configured to interconnect at least portions of upper portions of the pair of side parts; a second frame configured to interconnect at least portions of lower portions of the pair of side parts; a first wing portion attached to the upper portions of each of the pair of side parts at an outside of the pair of side parts; and a second wing portion attached to the lower portions of each of the pair of side parts at the outside of the pair of side parts, wherein the first wing portion comprises a first hole, and the second wing portion comprises a second hole, wherein the first hole of the first jig and the second hole of the second jig communicate with each other, and wherein the jig assembly further comprises a fixing member configured to fix the first hole of the first jig and the second hole of the second jig to each other.
 15. The jig assembly of claim 14, wherein the fixing member comprises a first fixing member and a second fixing member configured to be fastened to each other or to be separated from each other.
 16. The jig assembly of claim 14, wherein the first jig and the second jig comprise Teflon.
 17. An apparatus for electroless plating, comprising: a jig, comprising: a pair of side parts facing each other; holders formed at inner portions of the pair of side parts, the holders being protruded and facing each other; a first frame configured to interconnect at least portions of upper portions of the pair of side parts; and a second frame configured to interconnect at least portions of lower portions of the pair of side parts, and a plurality of cartridge assemblies of claim 1, wherein the plurality of cartridge assemblies are disposed at the holders of the jig.
 18. The apparatus for electroless plating of claim 17, wherein, the plurality of cartridge assemblies are disposed at the holders in a zigzag manner with respect to the pair of side parts.
 19. The apparatus for electroless plating of claim 17, wherein, the plurality of cartridge assemblies are disposed at the holders along an oblique or diagonal direction with respect to the pair of side parts.
 20. The apparatus for electroless plating of claim 17, wherein the first cartridge and the second cartridge comprise Teflon. 